Apparatus for loading and unloading burn-in boards

ABSTRACT

An apparatus for rapidly and automatically handling packaged integrated circuits (ICs) during the loading or unloading of burn-in boards. The apparatus also segregates and offloads packaged ICs into a plurality of reservoirs for controlled delivery into suitable transport media on the basis of the level of functionality attained by each part during the burn-in process. The apparatus is computer controlled, with operator interface and an electronic control panel. The apparatus employs a linear induction motor drive system to rapidly, precisely and accurately move the ICs both between a loading/unloading location and a staging location, and at the staging location itself during the segregation and offloading steps. The system may be extended to operate in either the single or dual mode, employing two sorting and offloading components to unload a single device under test board. The apparatus uses an indexing table to controllably move an array of sockets on a burn-in board in a stepwise manner, such that one or more sockets (preferably a row of sockets) may be accurately located beneath insertion/extraction heads so that ICs may be sequentially loaded or sequentially unloaded. In one embodiment particularly applicable to burn-in boards having low-insertion-force sockets, extracted ICs are placed on a staging tray by gripper-type insertion/extraction heads. In another embodiment particularly applicable to burn-in boards having zero-insertion-force sockets, vacuum-type insertion/extraction heads are mounted on a support member which is coupled to the linear induction motor.

FIELD OF THE INVENTION

This apparatus relates to an apparatus for controlled loading, unloadingand handling of packaged integrated circuit (IC) devices from a burn-inboard or other multi-socketed device-testing board.

BACKGROUND OF THE INVENTION

The physical and electrical integrity of monolithic integrated circuitdevices are routinely ascertained at various stages of the manufacturingprocess. Although such circuit devices may be individually tested, it ismuch more efficient to test them in groups. A burn-in test is typicallythe last test to which an integrated circuit (IC) is subjected followingencapsulation in a plastic or ceramic package, and prior to packing andshipment. Some ICs are shipped as bare die (i.e., unencapsulated).However, even the bare die must be burned in, and this is usuallyaccomplished by placing each bare die in a temporary package. Theburn-in test usually involves imposing controlled electrical and thermalstresses upon a group of packaged IC devices (also referred to aspackaged ICs) which have been loaded into sockets on a burn-in board(BIB) and placed in a controlled environment. Upon completion of theburn-in test, fully-functional, partially-functional and nonfunctionalIC devices are identified, the IC devices are unloaded from the burn-inboard, and ICs are segregated on the basis of functionality, with thefully-functional and partially-functional IC devices being loaded intocarrier containers for subsequent transfer or storage. The nonfunctionalIC devices are generally scrapped.

The manner and means by which packaged IC devices are loaded andunloaded from a burn-in board or device-testing board (DTB) is theprimary focus of this invention. In addition, a secondary focus of theinvention is the manner and means by which the packaged IC devices aresorted and loaded into transport media.

Various devices and mechanisms have been developed in the industry toinsert packaged IC devices into the sockets on burn-in boards, extractpackaged IC devices from those sockets once the burn-in operation iscomplete, and sort the extracted packaged IC devices. One typical toolused to insert packaged IC devices into and extract packaged IC devicesfrom low insertion force (LIF) sockets on burn-in boards consists of apair of controllable, opposed, gripping fingers which grip oppositeedges of the packaged IC device and then operate on the package in adirection orthogonal to the surface of the burn-in board so as to insertor extract the packaged IC device. SMC Pneumatics Corp. manufactures an"MHP Series" of pneumatically-operated gripping devices that are used toimplement certain embodiments of the instant invention. Dual-in-linepackages (DIP) and small outline J-lead packages (SOJ) are common ICpackages which may be handled by such gripper devices. Pneumatic holdingdevices are used to load and unload zero-insertion-force sockets, andsuch holding devices are used to implement other embodiments of theinstant invention.

BRIEF SUMMARY OF THE INVENTION

The inventive apparatus rapidly and automatically handles packagedintegrated circuit (IC) devices during the loading or unloading ofburn-in boards. The apparatus also segregates and offloads packaged ICdevices into a plurality of reservoirs for controlled delivery intosuitable transport media on the basis of the level of functionalityattained by each part during the burn-in process. The apparatus iscomputer controlled, with operator interface and an electronic controlpanel. The apparatus employs a linear induction motor drive system torapidly, precisely and accurately move the packaged IC devices bothbetween a loading/unloading location and a staging location, and at thestaging location itself during the segregation and offloading steps. Thesystem may be extended to operate in either the single or dual mode,employing two sorting and offloading components to unload a singledevice under test board. The apparatus uses an indexing table tocontrollably move an array of sockets on a burn-in board in a stepwisemanner, such that one or more sockets (preferably a row of sockets) maybe accurately located beneath insertion/extraction heads so thatpackaged IC devices may be sequentially loaded or sequentially unloaded.

In one embodiment of the invention which is particularly applicable toburn-in boards having low-insertion-force sockets, extracted IC devicesare placed on a staging tray by gripper-type insertion/extraction heads.Spacing of the packaged IC devices on the staging tray remains identicalto that on the burn-in board. The staging tray is coupled to the linearinduction motor so that it may be moved to a staging location where itis moved in a step-wise manner so that individual packaged IC devicesare lined up with and propelled into one of multiple sorting tubes orbins which corresponds to the level of functionality determined for thatparticular IC device.

In another embodiment of the invention, which is particularly applicableto burn-in boards having zero-insertion-force sockets, vacuum-typeinsertion/extraction heads are mounted on a support member which iscoupled to the linear induction motor. The unloaded packaged IC devicesare then transported to the staging location attached to theinsertion/extraction heads. As a head, in a step-wise manner, passes thesorting tube or bin associated with the level of functionalityattributed to the packaged IC device which it is carrying, the IC deviceis released into the tube or bin.

In yet another embodiment of the invention, the sorter mechanism is madeup of a plurality of vertically-stacked tubes which are moveable in avertical plane so that each tube may be selectively aligned with anoffloading path when a device having the performance characteristicsassociated with the selected tube is presented at the offloading path bythe staging tray or support member.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of a first preferred embodiment of anapparatus for loading and un-loading DTB and offloading and sorting theunloaded devices;

FIG. 2A is an isometric view of the assembled components of the firstpreferred embodiment of the apparatus, with a DTB installed thereon;

FIG. 2B is an isometric view of the assembled components of a secondpreferred embodiment of the apparatus with two staging trays and twooffloading and sorting means;

FIG. 3 is an exploded view of the packaged IC extraction means and astaging tray, with a packaged IC device being released to drop into thetray;

FIG. 4 is a side view of the linear induction motor drive assembly andthe pneumatic air cushion assembly;

FIGS. 5A, 5B, 5C, and 5D are sequential side views of the grippersgripping and extracting packaged IC devices from the DTB, and thenholding and depositing them onto the staging tray;

FIG. 6 is a side view of the offloaded IC device sorting mechanism;

FIGS. 7A, 7B, 7C, and 7D show the operation logic of the first preferredembodiment of the side offloading and sorting system; and

FIG. 8 is an isometric view of a third embodiment of the invention whichemploys pneumatic devices to retain and move packaged IC devicesdesigned for zero-insertion force sockets.

DESCRIPTION OF A FIRST PREFERRED EMBODIMENT

FIG. 1 is an isometric view of a first preferred embodiment that isgenerally designated by the number 1.0. The automated computercontrolled apparatus loading and unloading burn-in boards and forsorting and offloading unloaded parts is comprised of seven primarysystem components: (1) an indexing table assembly 1.1; (2) an IC deviceextraction assembly 1.2; (3) a staging tray assembly 1.3; (4) a linearinduction motor 1.4; (5) an air jet impeller assembly 1.5; (6) one ormore output track assemblies 1.6A and 1.6B; and (7) an integratedcomputer controller (not shown).

Still referring to FIG. 1, the preferred embodiment is housed in and issupported by a generally rectangular box shaped frame 1.7 havingparallel vertical, opposing sides and upper and lower opposinghorizontal surfaces. The upper horizontal surface generally supports andsecures the working components of the apparatus and the space within theframe generally contains mechanical, electronic and pneumaticaccessories (not shown), which are required to implement and empower thevarious components of the disclosed apparatus.

Referring now to FIG. 2A, the indexing table assembly 1.1 controllablyand bidirectionally moves a removably attached burn-in board 2.1 in astepwise manner during the extraction of the packaged IC devices whichare removably installed in sockets 2.2 on the burn-in board 2.1. Theindexing table assembly 1.1 comprises a generally rectangular, flattable which is configured to precisely, accurately, and removably securethe burn-in board 2.1 on its upper horizontal surface. The sockets 2.2on the burn-in board 2.1 are normally arranged in a plurality ofparallel rows and a plurality of parallel columns. A single packagedintegrated circuit is removably installable in each socket 2.2. Theindexing table 1.1 rests and moves, in rolling and confined contact,upon two parallel rails 2.3A and 2.3B which are fixedly mounted on theupper surface of the frame 1.7. The indexing table 1.1 is operablycoupled to a computer-controlled worm gear assembly 2.4 which is drivenby a conventional electric motor 2.5 and appropriate associatedservomechanisms (not shown), which are housed within the supportingframe 1.7. The indexing table 1.1 is driven by the worm gear assembly2.4 such that it moves horizontally and reciprocally, in apredetermined, stepwise manner on the rails 2.3A and 2.3B. Suitable,operably-connected sensors limit the travel of the indexing table 1.1 inboth directions.

Referring now to FIG. 2A and FIG. 3, the IC device extraction assembly1.2 is adjustably mounted on a movable support 2.6 which, in turn, isslidably mounted on a vertical mounting plate 2.7, which is attached tothe upper surface of frame 1.7. The IC device extraction assembly 1.2comprises a row of commercially-available gripper devices 3.1A-3.1Q. Therow of gripper devices 3.1A-3.1Q is arranged in a vertical plane that isorthogonal to the burn-in board 2.1 and parallel to the rows of socketsthereon.

Referring now to FIG. 5A, each gripper device 3.1 has a pair ofpneumatically-operated jaws 5.1A and 5.1B which are designed to grasp apackaged IC device 5.2. All gripper devices are pneumatically actuatedin unison with the others in the row. Likewise, all gripper devices areraised and lowered simultaneously within the vertical plane by apneumatic cylinder (not shown).

Referring once again to FIG. 3, the staging tray assembly 1.3 receivesindividual packaged IC devices 5.2 from the extraction assembly 1.2 andtransports them to an offloading and sorting site. The staging trayassembly 1.3 is a generally rectangular shaped, flat plate having aplurality of identical parallel grooves 3.2, which extend from edge toopposing edge of the upper surface of the plate. The number of grooves3.2 equal the number of gripper devices 3.1 in the extraction assembly1.2, are spaced so as to conform to the spacing of the gripper devices3.1 on the extraction assembly 1.2, and are shaped to receive a packagedIC device 5.2 in each slot. The dimensions of depth and width of thegrooves 3.2 are selected to limit closely the position and orientationof the particular type of packaged IC device received so that the ICdevice may be precisely controlled by appropriate sensors and movers intheir respective locations. The parallel grooves 3.2 are orientedorthogonal to the row of grippers 3.1A-3.1Q.

Referring once again to FIG. 2A, the linear induction motor driveassembly 1.4 comprises a moving element called the forcer (shown in FIG.4), to which the staging tray 1.3 is rigidly affixed, and a stationaryelement called the platen 2.7. The forcer is slidably attached to theplaten and rides on a cushion of pressurized air. The platen 2.7 isdirectly mounted to a T-bar 2.8, which functions as a bridge. The bridgeis directly mounted to the support stands 2.9A, 2.9B, and 2.9C which, inturn, are rigidly affixed to the frame 1.7. In this particular case,support stand 2.9A is located beneath the offloading and sorting site,and two other support stands are located on opposite sides of theindexing table assembly 1.1. The platen 2.7 extends transversely abovethe indexing table 1.1, orthogonal to the direction of travel of thetable and in a plane above and parallel to the upper surface of theindexing table.

Referring now to FIG. 4 the moving element or forcer 4.1 incorporatestwo parallel electromagnets 4.2A and 4.2B, which are identical in designand configuration, and a strong rare earth magnet 4.3 which locatedproximate and between the two electromagnets. Each electromagnet 4.2 hasa pair of toothed pole faces 4.4A and 4.4B, which concentrate themagnetic flux. The platen 2.7 is a passive toothed steel bar whichextends over the desired length of travel. The teeth on the platen 2.7and the electromagnet 4.2, although located in different planes, areparallel to one another. They are also parallel to the slots of thestaging tray 1.3. The four sets of teeth on the forcer (two sets on eachelectromagnet) are spaced in quadrature so that only one set at a timecan be aligned with the platen teeth as it moves along the platen. Theair cushion bearing between the forcer 4.1 and the platen 2.7 isprovided by an inverted, cup shaped, generally rectangular enclosure 4.5which is open on the bottom and is removably and adjustably mountedabove and integral with the forcer. This enclosure 4.5 has a pneumaticair inlet 4.6 on one side, operably connected to an air supply (notshown), through which pressurized air is introduced into enclosure 4.5.The pressurized air escapes between the sliding surfaces of the forcer4.1 and the platen 2.7, thus creating the air cushion bearing betweenthe forcer 4.1 and the platen 2.7 and preventing intimate contactbetween those two parts.

FIGS. 5A-5D detail the operation of a single gripper device 5.1 duringthe IC device unloading cycle.

Referring now to FIG. 5A, as the burn-in board is moved by the indexingtable 1.1, row by row in a stepwise manner, beneath the IC deviceextraction assembly 1.2, the row of grippers is lowered within thevertical plane, with each gripper 3.1 having its jaws 5.1A and 5.1B inan open position.

Referring now to FIG. 5B, upon reaching the lowest point of travel, thejaws are pneumatically closed so that each gripper device grasps apackaged IC device 5.2 that has been installed in the socket 2.2 withits leads 5.3 facing downward. The row of gripper devices 3.1 is thenraised by the pneumatic cylinder, thus extracting an entire row ofpackaged IC devices from the burn-in board.

Referring now to FIG. 5C, the row of gripper devices 3.1 and the ICdevices 5.2 held within the jaws of each gripper device 3.1 are raisedto a level above the staging tray 1.3. Once so raised, the row ofpackaged IC devices is maintained in that position until the stagingtray 1.3 is moved between the row of gripper devices 3.1 and the burn-inboard 2.1 and positioned such that the grooves 3.2 in the staging tray1.3 line up with the IC devices positioned above.

Referring now to FIGS. 3 and 5D, once the staging tray 1.3 is positionedbelow the row of elevated IC devices, the packaged IC devices arereleased by the gripper devices 3.1 into the grooves 3.2 of the stagingtray 1.3.

Referring once again to FIG. 2A, the staging tray 1.3 moves in ahorizontal plane that is above and parallel to the plane in which theburn-in board moves. The direction of movement of the staging tray isorthogonal to the direction of movement of the burn-in board.

Referring now to FIG. 6, the IC device position sensing means 6.1 sensesan individual IC device 5.2 the staging tray 1.3. The IC device sensingmeans 6.1, which comprises a standard reflective photocell sensor thatsenses the presence or absence of an IC device upon the staging tray, isappropriately and adjustably mounted in a suitable housing 6.2. Thishousing is fixedly attached above and parallel to and proximate the pathof the upper surface of the staging tray 1.3 which contains the ICdevices 5.2 that have been extracted by the grippers and released uponthe tray 1.3.

Still referring to FIG. 6, an air jet propulsion device 6.3A or 6.3Bimpels individual IC devices from their position on the staging tray 1.3into selected output tubes or bins (see items 2.10A and 2.10B of FIG.2A). The air jet propulsion devices 6.3A and 6.3B, of standard design,are adjustably mounted on each end of a housing 6.2 which sits atop theoffloading track assemblies 1.6A and 1.6B. Each jet propulsion device6.3 is operably and pneumatically connected to an air supply (notshown). The opposing air jets 6.3A and 6.3B are oriented to face oneother, with the long axis of an individual staging tray slot 3.2extending between them. When an IC device is sensed by the sensing means6.1, a computer command is given to the air supply to activate theappropriate air jet 6.3A or 6.3B to displace the IC device into thetrack of the appropriate offloading track assembly 1.6A or 1.6B. Thehousing 6.2 is of generally rectangular shape and rigidly affixed to theoffloading track assemblies 1.6A and 1.6B. The opposing ends of thehousing 6.2 are appropriately shaped to enclose and guide an IC deviceas it leaves one of the opposing ends of the matching-tray slots andenters the upper end of one of the offloading track assemblies 1.6A or1.6B. Each track extends outwardly, normal to the path of the stagingtray and downwardly in the same vertical plane and in opposingdirections from the proximate opposing sides of the staging tray. Asseen in FIG. 2A, the opposing lower ends of the respective tracks arepositioned proximate an open end of one of a plurality of appropriatelyoriented, suitably configured, commercially available, IC device carriertubes 2.10A and 2.10B.

Referring once again to FIG. 1 and FIG. 2A, the opposing end ofoffloading track 1.6A is directed to a point on the upper surface of thesupporting frame 1.7, proximate a standard carrier tube rack assembly1.8. This rack assembly comprises a pair of vertical posts, 1.9A and1.9B, each of which has a vertical slot which faces the opposite post.These slots are configured to closely confine the opposing ends of asingle vertical stack of individual, empty carrier tubes 2.10A, with thestack of tubes being parallel, but offset from offloading track 1.6A.When a tube is required for offloading, the tube rack assembly 1.8singulates the bottom-most tube in the stack by moving it laterally sothat, from a top plan view perspective, it is aligned with theoffloading track 1.6A, with the open end thereof proximate the end ofthe offloading track 1.6A, and lowering the closed end of the singulatedtube so that, from a side elevational view perspective, the tube isaligned with offloading track 1.6A.

Resting on the upper surface of the offloading track 1.6A, at the lowerend thereof and adjustably and operably mounted thereon, is acommercial, customized singularion wheel assembly 2.11A (see also FIG. 6for operational details) which detects, counts and singulates by rollingcontact, each IC device as it slides down the offloading track 1.6A fromthe staging tray to a singulated carrier tube. When the computercontrolled counter which is integral with the wheel detects that apredetermined number of IC devices have been loaded into a carrier tube,the loaded tube is automatically released so that it falls into ahopper. An empty carrier tube from the rack is then pneumaticallypositioned to replace the loaded tube. The operator periodically, asneeded, replenishes the supply of empty carrier tubes in the rackassembly as they are filled during the operation of the apparatus.

In the preferred embodiment of the invention, offloading track 1.6A andtube rack assembly 1.8 are used to offload and receive IC devices thatare identified during the testing sequence as being acceptable forshipment or further processing. Offloading track 1.6B, which extendsoutwardly and downwardly in the same vertical plane, but in the oppositedirection from track 1.6A, is used to receive those IC devicesidentified during the previous testing phase of integrated circuitmanufacture as unacceptable in some way. Track 1.6B has the same generaldesign and dimension as track 1.6A, although either track may bemodified to satisfy individual operational requirements. Offloadingtrack 1.6B also has commercially available singulation wheel assembly2.11B resting on the upper surface of the track, near the lower end andadjustably and operably mounted thereon, which detects, counts andsingulates by rolling contact, each IC device as it moves from thestaging tray to one of the carrier tubes in the stack of sloping carriertubes 2.10B, which are installed on a sloping carrier tube rack assembly2.12.

Each tube of the stack of sloping carrier tubes 2.10B is held on itsopposing ends by two vertical, parallel tube racks 2.13A and 2.13B,which are adjustably mounted on opposing edges of one face of a flat,vertical, generally rectangular plate 2.14. Rectangular plate 2.14 ismovable in the vertical plane by a commercially available motor driven,step wise operated, computer controlled worm gear assembly (not shown)located within frame 1.7. Thus, any of the tubes in the sloping stack2.10B may be aligned with the offloading track 1.6B.

Each tube slot on rack assembly 2.12 is identified and classified by thecomputer to accept only computer designated kinds of unacceptable ICdevices. Thus IC devices having different kinds of defects can beselectively delivered to one or more particular carrier tubes. It is tobe understood that IC identification and classification occurs duringthe burn-in board testing phase prior to introduction of the burn-inboard into the apparatus.

The integrated computer control means controls the operation of theapparatus, in cooperation with the operator. The operational sequence ofthe apparatus was discussed generally in the summary of the inventionand more specifically in the above description of the first preferredembodiment. The operational logic of the first embodiment is shown inFIGS. 7A, B, C, D. The software necessary for the computer operation ofthe apparatus is designed to interface with the operator, to control allappropriate interrelated mechanical, electrical and pneumatic componentsand to process all relevant information concerning the integrity andnumber of IC devices being processed and to implement the sorting andstoring of the IC devices in the designated carrier tubes.

DESCRIPTION OF THE SECOND PREFERRED EMBODIMENT

FIG. 2B is an isometric view of a modified first embodiment whichincorporates two offloading sites, one on each side of the burn-inboard. The offloading sites are essentially mirror images of oneanother. Such a modified system permits the use of two staging trays inorder to increase throughput.

The software of this dual system is designed to allow the two stagingtrays and sorting means to work together in the offloading and sortingof multiple burn-in boards. The software is also designed to alloweither side of the apparatus to operate independently while the opposingside is closed down for loading and unloading of carrier tubes or systemrepair and maintenance or any other operational purpose.

The operational logic of the dual system is a straightforward extensionof the logic of the single system shown in FIGS. 7A, 7B, 7C, and 7D.Provisions are also made for operation of each side individually, asmentioned above. The computer program is not considered a part of thisinvention but rather a convenient and efficient means for implementingthe invention.

The present invention has been described in two preferred embodiments.Modifications and variations may become apparent to those skilled in theart. However the scope of the invention is not limited by the abovedescribed detail but only by the appended claims.

DESCRIPTION OF THE THIRD PREFERRED EMBODIMENT

Referring now to FIG. 8, a third embodiment of the invention features alinear induction motor having a platen 8.1, a forcer 8.2 on which vacuumextraction/loading heads 8.3A-8.3H are mounted, and an indexably movableplatform 8.4 at a loading station. Vacuum extraction/loading heads arepreferred for zero-insertion force type sockets. A carrying tray 8.5,having accurate locationing of stored parts, is shown mounted on theindexably movable platform 8.4. In this to particular case, the vacuumheads 8.3 are ganged in a row, and spaced such that an entire row of ICdevices 8.6 may be removed from the carrying tray 8.5 simultaneously. Asthe spacing is wider on the burn-in board 8.6 than for the carrying tray8.5, the IC devices that were removed from the carrying tray 8.5 aredeposited one at a time in sockets of a single row on the burn-in board.Such a procedure requires the forcer to execute eight move and stopsequences as individual IC devices are deposited into the eight socketspertaining to individual rows on the burn-in board.

It should be noted that this type of arrangement could also beimplemented with a gang of gripper-type devices and an elevable linearinduction motor assembly. The supports 8.7A and 8.7B at opposite ends ofthe platen 8.1 may be fitted with slidable pistons which elevate theplaten evenly when the extraction assembly must be raised. Such anarrangement can also utilize a single vacuum head or gripper instead ofa multiple ganged heads or grippers.

It should also be noted that any of the three disclosed embodiments canbe modified to load, as well as unload, burn-in boards. The process ofloading is basically the reverse of unloading, with the sorting andoffloading station replaced by an indexable carrying tray station suchas that disclosed in the third embodiment section.

Although only several embodiments of the invention have been disclosedherein, it will be obvious to those having ordinary skill in the art ofsuch equipment that changes and modifications may be made theretowithout departing from the scope and the spirit of the invention ashereinafter claimed. In addition, it should be obvious to those ofordinary skill in the art that features of one embodiment may beincorporated in other embodiments, and that certain features are, 15therefore, not meant to be exclusive to one particular embodiment.

What is claimed is:
 1. A machine for unloading packaged integratedcircuit (IC) devices from sockets on a burn-in board, moving said ICdevices to an intermediate location, and transferring the unloaded ICdevices from the intermediate location to a staging location, saidmachine comprising:an indexing system for positioning at least oneloaded socket on said board directly beneath said intermediate location;at least one extraction device for extracting an IC device from saidsocket and moving said IC device to said intermediate location; atransport device for transporting an extracted IC device from theintermediate location to the staging location; and a linear inductionmotor coupled to said transport device, said motor providingbidirectional linear motion to said transport device between saidintermediate location and said staging location.
 2. The machine of claim1, wherein said indexing system is an indexing table to which theburn-in board is removably affixed, said indexing table being precisely,accurately, and bidirectionally moveable in a plane parallel to theaffixed burn-in board.
 3. The machine of claim 1, wherein saidextraction device comprises at least one pair of jaws which may becontrollably closed to grip opposing sides of an IC device during theextraction of the IC device from a friction-contact-type socket and themoving of said IC device to said intermediate location, and opened torelease said IC device upon arrival at said intermediate location. 4.The machine of claim 3, wherein said transport device is a staging traycoupled to said linear induction motor which is slidable moveablebetween said intermediate location and said staging location.
 5. Themachine of claim 1, wherein said extraction device comprises a vacuumhead which may be controllably activated to hold the IC device duringextraction from a zero-insertion-force-type or clamshell-type socket andtransport said IC device to said intermediate location, and deactivatedto release said IC device upon arrival at said intermediate location. 6.The machine of claim 5, wherein said transport device is a supportmember to which said vacuum heads are attached, said support memberbeing coupled to said linear induction motor and being slidable moveablebetween said intermediate location and said staging location.
 7. Themachine of claim 1, wherein said staging location comprises means forloading said devices into transport media, said media being selectedfrom the group consisting of device shipping trays and device shippingtubes.
 8. The machine of claim 1, wherein said staging locationcomprises means for sorting unloaded IC devices into categories based onperformance specifications.
 9. The machine of claim 7, wherein saidstaging location further comprises means for loading sorted devices intotransport media, said media being selected from the group consisting ofdevice shipping trays and device shipping tubes.
 10. The machine ofclaim 8, wherein said means for sorting comprises a plurality ofvertically-stacked tubes which are moveable in a vertical plane so thateach tube may be selectively aligned with a loading path when a devicehaving the performance characteristics associated with the selected tubeis presented at said path.
 11. A machine for transferring packagedintegrated circuit (IC) devices from a staging location to anintermediate loading location, and loading said IC devices from saidintermediate location into sockets on a burn-in board, said machinecomprising:a transport device for transporting at least one IC devicefrom the staging location to the intermediate location; a linearinduction motor coupled to said transport device, said motor providingbidirectional linear motion to said transport device between saidstaging location and said intermediate location; an indexing system forpositioning at least one empty socket on said board directly below saidintermediate location; and at least one device for moving said IC devicefrom said intermediate location and inserting said IC device into saidempty sockets.
 12. The machine of claim 11, wherein said indexing systemis an indexing table to which the burn-in board is removable affixed,said indexing table being precisely, accurately, and bidirectionallymoveable in a plane parallel to the affixed burn-in board.
 13. Themachine of claim 11, wherein said device for moving and insertingcomprises at least one pair of jaws which may be controllably closed togrip opposing sides of an IC device during transport of said IC devicefrom the intermediate location to said empty socket, during insertion ofthe IC device into a friction-contact-type socket, and which may becontrollably opened to release said IC device once insertion iscomplete.
 14. The machine of claim 13, wherein said transport device isa staging tray coupled to said linear induction motor which is slidablemoveable between said intermediate location and said staging location.15. The machine of claim 11, wherein said device for moving andinserting comprises a vacuum head which may be controllably activated tohold an IC device during transport of said IC device from theintermediate location to said empty socket, during insertion of the ICdevice into a zero-insertion-force-type or clamshell-type socket, andwhich may be controllably deactivated to release said IC device onceinsertion is complete.
 16. The machine of claim 15, wherein saidtransport device is a support member to which said vacuum heads areattached, said support member being coupled to said linear inductionmotor and being slidable moveable between said intermediate location andsaid staging location.
 17. A machine for unloading packaged integratedcircuit (IC) devices from sockets on a burn-in board, said sockets beingarranged in a rows and columns, and sorting the unloaded devices, saidmachine comprising:a plurality of extraction devices for simultaneouslyextracting IC devices loaded in the sockets of an entire row and movingthe extracted IC devices to an intermediate location, said extractiondevices having a spacing identical to that of the sockets within eachrow; an indexing system for positioning loaded sockets of a single rowdirectly beneath the extraction devices; a transport device fortransporting the extracted IC devices from the intermediate location toa staging location; and a linear induction motor coupled to saidtransport device, said motor providing bidirectional linear motion tosaid transport device between said intermediate location and saidstaging location.
 18. The machine of claim 17, wherein said indexingsystem is an indexing table to which the burn-in board is removablyaffixed, said indexing table being precisely, accurately, andbidirectionally moveable in a plane parallel to the affixed burn-inboard.
 19. The machine of claim 17, wherein each extraction devicecomprises at least one pair of jaws which may be controllably closed togrip opposing sides of an IC device as it is extracted from afriction-contact-type socket and transported to the intermediatelocation, and controllably opened to release the IC device upon arrivalat the intermediate location.
 20. The machine of claim 17, wherein eachextraction device comprises a vacuum head which may be controllablyactivated to hold an IC device as it is extracted from azero-insertion-force-type or clamshell-type socket and transported tothe intermediate location, and controllably deactivated to release theIC device upon arrival at the intermediate location.
 21. The machine ofclaim 17, wherein said staging location comprises means for sorting theunloaded IC devices into categories based on performance specifications.